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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Qualcomm
Type Snapdragon S3 MSM8260
Year Released 2010
FunctionMain function of the component  Multi-core Application Processor with Modem

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 10 pipeline stages
Type of processor core(s)Type and allocation of processor core(s) 2x Qualcomm Scorpion
Number of processor core(s) dual-core

BusesBuses: 
Memory Interface(s):   LPDDR2 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 266 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit
Number of data bus channels 1 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 2.13 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  Yes


Clock FrequenciesClock Frequencies: 
Recommended Minimum Clock Frequency 1200 MHz min.
Recommended Maximum Clock Frequency 1700 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 16 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 16 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 512 Kbyte L2

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 45 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 220 GPU
GPU Clock 266 MHz GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  CSDCircuit Switched Data (CSD) is the original data link protocol of GSM. Up to 9600bit/s download speed , GPRSGeneral Packet Radio Service , EDGEEnhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , UMTSUniversal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPAHigh-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSUPA 5.8 , HSUPA 11.5 , HSDPAHigh-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , HSDPA 7.2 , HSPA+ 21.1 , HSPA+ 28.8 data links

Additional InformationAdditional Information: 
Special Features
2x Qualcomm Scorpion Harvard Superscalar processor, 266MHz LPDDR2 memory interface, Hexagon QDSP6 400MHz, GSM, GPRS, EDGE, UMTS/WCDMA, HSDPA 7.2Mbps, HSUPA 5.76Mbps, HSPA+ 28Mbps/11Mbps, MBMS baseband modem, gpsOneGen 8 with GLONASS, gpsOneXTRA Assistance, 16 MP camera support, 1080p video encode, 1080p.. ››

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2011-01-27 19:58
 
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