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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Samsung
Type S3C2450
Year Released 2008
FunctionMain function of the component  Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv4T
Number of processor core(s) 1
Type of processor core(s)Type and allocation of processor core(s) ARM926EJ

BusesBuses: 
Memory Interface(s):   mobile (LP) DDR SDRAM
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit
Number of data bus channels 1 ch
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  moviNANDmoviNAND is a multimedia card (MMC) controller and onboard firmware developed by Samsung in 2006 , NAND Flash Interface
DMA ChannelsDMA (Direct Memory Access) allows direct data transfer between operative memory (RAM) and peripherals (hard disk, non-volatile storage, etc.) bypassing processor core. Multiple DMA channels allows parallel DMA operations. 8 ch


Clock FrequenciesClock Frequencies: 
Recommended Minimum Clock Frequency 400 MHz min.
Recommended Maximum Clock Frequency 533 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 16 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 16 Kbyte D-Cache

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 65 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component Samsung
PinsNumber of pins on the package 400 pins
Supply Voltage 1.2 V

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). N/A

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Communication InterfacesCommunication Interfaces: 
Supported USB Specification:   No
Bluetooth supportThis field specifies the supported BT version  No
Wireless LAN supportThis field enumerates the supported Wi-Fi protocols  No
Supported Audio/Video Interface:   No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s):   No

Additional InformationAdditional Information: 
Special Features
64KB internal general purpose SRAM, 32KB internal ROM for moviNAND booting, 2D graphics accelerator, 8-channel DMAs with external request pins

Datasheet AttributesDatasheet Attributes: 

Related Page URL
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2009-02-08 18:49
 
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