PhoneDB - infinitely detailed




FacebookGoogle PlusRSS FeedTwitter

Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Qualcomm
Type Dragonwing QCS4490
Year Released 2023
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) ARMv8-A (A32, A64)
Type of processor core(s)Type and allocation of processor core(s) 2x ARM Cortex-A78 + 6x ARM Cortex-A55 MPcore
Number of processor core(s) octa-core

BusesBuses: 
Memory Interface(s):   LPDDR4x SDRAM , LPDDR5 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 3200 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 16 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 25.6 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  eMMC 5.1Complies with embedded MMC 5.1 specification released in 2015 , UFS 2.1UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface , UFS 3.1UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 2400 MHz max.

Cache MemoriesCache Memories: 
Total L3 Cache 1024 Kbyte L3

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 4 nm
Semiconductor Technology:   FinFETMultigate (usually double-gate) MOSFET transistor technology
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 613 GPU
GPU Clock 1010 MHz GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Additional InformationAdditional Information: 
Special Features
2x Qualcomm Kryo Gold (ARM Cortex-A78, up to 2.4 GHz) + 6x Qualcomm Kryo Silver (ARM Cortex-A55, up to 2 GHz) Harvard Superscalar cores, HMP, Hexagon DSP, 2520x1080 120 Hz HDR10+ display support, 1080p 60 fps video decode, 1080p 60.. ››

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2025-06-27 14:10
 
You are here: Processor Specs \ Qualcomm Dragonwing QCS4490