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Designer |
Qualcomm |
| Type: | Dragonwing QCS6490 |
| Year Released: | 2023 |
| Function |
Multi-core Application Processor |
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| Width of Machine Word |
64 bit |
| Supported Instruction Set(s): | ARMv8-A (A32, A64) |
| Type of processor core(s) |
4x Qualcomm Kryo 670 + 4x Qualcomm Kryo 475 MPcore |
| Number of processor core(s): | octa-core |
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| Memory Interface(s): | LPDDR4x SDRAM , LPDDR5 SDRAM |
| Max. Clock Frequency of Memory IF |
3200 MHz |
| Data Bus Width |
16 bit |
| Number of data bus channels: | 2 ch |
| Max. Data Rate |
25.6 Gbyte/s |
| Non-volatile Memory Interface |
UFS 2.2
, UFS 3.1
, UFS 3.1 2-lane |
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| Recommended Maximum Clock Frequency: | 2700 MHz max. |
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| Feature Size |
6 nm |
| Semiconductor Technology: |
FinFET |
| Fab |
TSMC |
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| Embedded GPU |
Qualcomm Adreno 643 GPU |
| GPU Clock: | 812 MHz GPU |
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| Supported Cellular Data Links |
No |
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| Special Features: 1x Qualcomm Kryo 670 Prime (ARM Cortex-A78, up to 2.7 GHz) + 3x Qualcomm Kryo 670 Gold (ARM Cortex-A78, up to 2.4 GHz) + 4x Qualcomm Kryo 475 Silver (ARM Cortex-A55, up to 1.9 GHz) Harvard Superscalar cores, HMP, Hexagon.. ›› |
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| Data Integrity |
Preliminary |
| Added |
2025-06-27 13:15 |
| Tweet | |
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