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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Samsung
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated SHV-E275S Galaxy Grand
ReleasedFirst official market release date in (year, month) 2013 Sep
Hardware DesignerThe company which designed this device Samsung Electronics
ManufacturerThe company which produces this device Samsung Electronics
CodenameThe codename internally identified the design project of this product. Model variants of the same model are identified and linked to each other via the same Codename Samsung Baffin
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  SmartphoneCallular voice-capable usually touchscreen mobile computer which natively runs third-party apps.

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 77.1 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 143.8 mm
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 9.8 mm
DimensionsAll dimensions are maximal values (measured between the furthest points of the device) in closed state 3.04x5.66x0.39 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 169 g
5.96 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 4.1.2 (Jelly Bean)Google Android 4.1.2 (Jelly Bean)
KoreanSubversion, update version, user interface, defualt language, etc.

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 1400 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Samsung Exynos 4 Quad 4412, 2012, 32 bit, quad-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache, 32 nm, ARM Mali-400 GPUSamsung Exynos 4 Quad 4412, 2012, 32 bit, quad-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache, 32 nm, ARM Mali-400 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  LPDDR2 SDRAM
400 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 1 GiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  Yes
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 8 GB ROM
3520 MiB total user storageThe sum of primary and secondary user-accessible partition of non-volatile storage spaces

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 127.3 mm
5 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 480x800
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 11.6 mm
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 64.5%
Pixel DensityIndicates the number of pixels per inch 186 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color TN-TFT LCDColor TN-TFT (Twisted Nematic - Thin Film Transistor). This is an active matrix LCD technology. display
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  Gorilla GlassIntroduced in 2007

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Broadcom BCM28155

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  stereo
Loudspeaker(s):   mono
Audio Output:   3.5mm

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  GSM900GSM900 phones support P-GSM (Primary GSM) 900 MHz (B8) band (downlink: 935.0 MHz - 960.0 MHz, uplink: 890.0 MHz - 915.0 MHz) and may support E-GSM (Extended GSM) 900 MHz band (downlink: 925.0 MHz - 960.0 MHz, uplink: 880.0 MHz- 915.0 MHz. , GSM1800GSM1800 phones support GSM / DCS / PCS 1800 MHz (B3) band (downlink: 1805.2 - 1879.8 MHz, uplink: 1710.2 - 1784.8 MHz). , GSM1900GSM1900 phones support PCS 1900 MHz (B2) band (downlink: 1930.2 - 1989.8 MHz, uplink: 1850.2 - 1909.8 MHz) , UMTS2100 (B1)UMTS2100 phones support UMTS 1900 / 2100MHz (IMT, also refferred as UMTS Band I) band (downlink: 2112.4 - 2167.6 MHz, uplink: 1922.4-1977.6 MHz) , UMTS1900 (B2)UMTS1900 phones support UMTS 1900MHz (PCS, also refferred as UMTS Band II) band (downlink: 1932.4 - 1987.6 MHz, uplink: 1852.4-1907.6 MHz) , LTE1800 (B3)LTE1800 phones support LTE 1800 MHz (LTE Band 3) band (downlink: 1805 - 1880 MHz, uplink: 1710 - 1785 MHz) , LTE850 (B5)LTE850 phones support LTE 850 MHz (LTE Band 5) band (downlink: 869 - 894 MHz, uplink: 824 - 849 MHz) bands
Supported Cellular Data LinksList of supported cellular data links and rates.  GPRSGeneral Packet Radio Service , GPRS C12 , EDGEEnhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , EDGE MSC12 , UMTSUniversal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPAHigh-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSUPA 5.8 , HSDPAHigh-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , HSPA+ 21.1 , LTELTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS). data links
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.  Yes
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc.  Voice transmissionDevice is able to receive and transmit voice over cellular network , Voice speakerDedicated voice speaker is located near to the ear when talking and optimized for the spectrum and peak-to-peak range of the human voice. , Vibrate , Speakerphone , ANCActive noise cancellation (ANC) , VoLTE

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch screen

Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash , microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB. , microSDXCA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB HS (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB Micro-B (Micro-USB)
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 4.0
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  802.11aShort range standard, 5 GHz, max. 54 Mbit/s , 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  DLNADLNA (Digital Living Network Alliance) over Wireless LAN , Wi-Fi TetheringWi-Fi Mobile Hotsport
NFCNear Field Communication is short-range wireless radio data exchange technology based on radio-frequency identification (RFID). This field enumerates the supported NFC technologies.  Yes

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  FM radio (88-108 MHz) with RDSFM radio (87.5-108MHz) with RDS
Digital Media BroadcastDigital multimedia (TV/audio) broadcast technologies like T-DMB, ISDB-T 1-seg, ISDB-T HDTV, DAB+, DVB-T, CMMB, etc.  T-DMBResolution: 320x240 (QVGA) receiver


Satellite NavigationSatellite Navigation: 
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Simultaneous GPS , A-GPS , Geotagging , QuickGPS
Supported GLONASS protocol(s)GLONASS is a global satellite navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 8.0 MP camera
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
8.0 x digital zoomDigital zoom is an image signal processing method which cuts out and enlarges a desired part of the captured image while losing the rest of the image
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  CD AFContrast-detection (CD) is a passive autofocus method without distance measurement which adjusts the optical system until maximum contrast is measured through the lens.
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  single LEDAlso known as mobile light
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 1.9 MP sec. cam
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1280x720 pixel
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in compassBuilt-in electroinc compass types: 1D, 2D, 3D  Yes
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  L sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen , P sensorBased on this sensor signal device may control the volume of the voice speaker or dim the display during a call

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 
BatteryBattery technology  Li-ion
removablePossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 2100 mAh battery

Geographical AttributesGeographical Attributes: 
Market CountriesCountries where the device was officially sold. Overlap is possible.  South Korea
Market RegionsRegions where the device was officially sold. Overlap is possible.  Asia
Mobile OperatorList of mobile operators (carriers) or distributors which sold the device in their own network SK TelecomSK Telecom

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2014-02-21 19:47
 

Samsung SHV-E275S Galaxy Grand (Samsung Baffin)

Samsung SHV-E275S Galaxy Grand (Samsung Baffin)
Platform: android Audio Output: audio_jack Supported Cellular Bands: gsm Supported Cellular Data Links: gprs Supported Cellular Data Links: edge Supported Cellular Data Links: umts Supported Cellular Data Links: hspa Supported Cellular Data Links: hspa_plus Supported Cellular Data Links: lte Complementary Phone Services: phone Complementary Phone Services: vibration Complementary Phone Services: speakerphone Expansion Interfaces Bluetooth Wireless LAN NFC FM Radio Receiver Digital Media Broadcast Complementary Satellite Services Supported GLONASS protocol(s) Number of effective pixels: 8.0 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 1.9 MP sec. cam Built-in compass Built-in accelerometer

See also

Samsung GT-i9118 Galaxy Grand Duos (Samsung Baffin)
Samsung GT-i9118 Galaxy Grand Duos (Samsung Baffin)
77.1x143.7x9.6 mm, Google Android 4.2.2 (Jelly Bean), Broadcom BCM28155, 1 GiB RAM, 8 GB ROM, 5 inch, 480x800, 5.0 MP camera, 2100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung GT-i9082C Galaxy Grand Neo+ Duos (Samsung Baffin)
Samsung GT-i9082C Galaxy Grand Neo+ Duos (Samsung Baffin)
77.1x143.7x9.6 mm, Google Android 4.2.2 (Jelly Bean), Broadcom BCM23550, 1 GiB RAM, 5 inch, 480x800, 5.0 MP camera, 0.3 MP sec. cam, 2100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung GT-i9128V Galaxy Grand TD (Samsung Baffin)
Samsung GT-i9128V Galaxy Grand TD (Samsung Baffin)
77.1x143.9x9.75 mm, Google Android 4.1.2 (Jelly Bean), Broadcom BCM28155, 1 GiB RAM, 8 GB ROM, 5 inch, 480x800, 8.0 MP camera, 1.9 MP sec. cam, 2100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SCH-i879 Galaxy Grand (Samsung Baffin)
Samsung SCH-i879 Galaxy Grand (Samsung Baffin)
77x143.5x9.75 mm, Google Android 4.1.2 (Jelly Bean), Broadcom BCM28155, 1 GiB RAM, 8 GB ROM, 5 inch, 480x800, 8.0 MP camera, 1.9 MP sec. cam, 2100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SHV-E270S Galaxy Grand (Samsung Baffin)
Samsung SHV-E270S Galaxy Grand (Samsung Baffin)
77.1x143.8x9.8 mm, Google Android 4.1.2 (Jelly Bean), Samsung Exynos 4 Quad 4412, 1 GiB RAM, 8 GB ROM, 5 inch, 480x800, 8.0 MP camera, 1.9 MP sec. cam, 2100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SHV-E270L Galaxy Grand (Samsung Baffin)
Samsung SHV-E270L Galaxy Grand (Samsung Baffin)
77.1x143.8x9.8 mm, Google Android 4.1.2 (Jelly Bean), Samsung Exynos 4 Quad 4412, 1 GiB RAM, 8 GB ROM, 5 inch, 480x800, 8.0 MP camera, 1.9 MP sec. cam, 2100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SHV-E270K Galaxy Grand (Samsung Baffin)
Samsung SHV-E270K Galaxy Grand (Samsung Baffin)
77.1x143.8x9.8 mm, Google Android 4.1.2 (Jelly Bean), Samsung Exynos 4 Quad 4412, 1 GiB RAM, 8 GB ROM, 5 inch, 480x800, 8.0 MP camera, 1.9 MP sec. cam, 2100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung GT-i9128 Galaxy Grand / GT-i9128E 3G TD (Samsung Baffin)
Samsung GT-i9128 Galaxy Grand / GT-i9128E 3G TD (Samsung Baffin)
77.1x143.9x9.75 mm, Google Android 4.1.2 (Jelly Bean), Broadcom BCM28155, 1 GiB RAM, 8 GB ROM, 5 inch, 480x800, 8.0 MP camera, 1.9 MP sec. cam, 2100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung GT-i9080 Galaxy Grand (Samsung Baffin)
Samsung GT-i9080 Galaxy Grand (Samsung Baffin)
76.9x143.5x9.6 mm, Google Android 4.1.2 (Jelly Bean), Broadcom BCM28155, 1 GiB RAM, 8 GB ROM, 5 inch, 480x800, 8.0 MP camera, 1.9 MP sec. cam, 2100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung GT-i9082 Galaxy Grand Duos (Samsung Baffin)
Samsung GT-i9082 Galaxy Grand Duos (Samsung Baffin)
76.9x143.5x9.6 mm, Google Android 4.1.2 (Jelly Bean), Broadcom BCM28155, 1 GiB RAM, 8 GB ROM, 5 inch, 480x800, 8.0 MP camera, 1.9 MP sec. cam, 2100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB (Samsung B6)
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Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB (Samsung B6)
Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB (Samsung B6)
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Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741R4 (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741R4 (Samsung B6)
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Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741R4 (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741R4 (Samsung B6)
F741UZSAUSC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741V (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741V (Samsung B6)
F741ULBEVZW, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

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