PhoneDB - infinitely detailed




FacebookGoogle PlusRSS FeedTwitter
Device SpecsDevice Specs1 
Search 
Compare 
List all 
FirmwareFirmware 
Search 
List all 
Processor SpecsProcessor Specs 
Search 
Compare 
List all 
OS SpecsOS Specs 
Search 
Compare 
List all 
Mobile OperatorsMobile Operators 
Search 
Compare 
List all 

IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Samsung
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated SPH-L710 Galaxy S III LTE
ReleasedFirst official market release date in (year, month) 2012 Jul 2
Hardware DesignerThe company which designed this device Samsung Electronics
ManufacturerThe company which produces this device Samsung Electronics
OEM IDThe OEM ID is internal code and refers to a specific variant of the model series SPHL710
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  SmartphoneCallular voice-capable usually touchscreen mobile computer which natively runs third-party apps.
List of Additional FeaturesComma separated list of low priority special features which are not included in other fields
mDNIe tecnology, NFC

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 70.6 mm
2.78 inchWidth measured in inches
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 136.6 mm
5.38 inchHeight measured in inches
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 8.6 mm
0.34 inchesDepth measured in inches
Bounding VolumeThe volume of the smallest cuboid which can bound the device in cubecentimetres 82.9 ccm
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 133 g
4.69 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Google Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 4.1.1 (Jelly Bean)Google Android 4.1.1 (Jelly Bean)
Operating System Kernel VersionThe OS kernel is the primary component of an operating system which manages hardware and software resources, schedules tasks and threads and provides interface for the upper software layers (system calls, interrupts, APIs, etc.) 3.0.8

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 1512 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Qualcomm Snapdragon S4 MSM8960, 2012, 32 bit, dual-core, 16 Kbyte I-Cache, 16 Kbyte D-Cache, 1024 Kbyte L2, 28 nm, Qualcomm Adreno 225 GPUQualcomm Snapdragon S4 MSM8960, 2012, 32 bit, dual-core, 16 Kbyte I-Cache, 16 Kbyte D-Cache, 1024 Kbyte L2, 28 nm, Qualcomm Adreno 225 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  mobile (LP) DDR2 SDRAM
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes) 2048 MiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  Yes
Non-volatile Memory CapacityNon-volatile memory in mebibytes (binary megabytes).2GB = 1907.3MiB, 4GB = 3814.7MiB, 8GB = 7629.4MiB, 16GB = 15258.8MiB, 32GB = 30517.6MiB, 64GB = 61035.2MiB, 128GB = 122070.3MiB, 256GB = 244140.6MiB, 512GB = 488281.3MiB, 1TB = 953674MiB, 2TB = 1907349Mi 15259 MiB non-volatile

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 122 mm
4.8 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 720x1280
921600 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display WidthThe distance between the vertical edges of the display (horizontal display size). In case of display with rounded edges this refers to the smallest bounding rectangle. 59.81 mm
2.35 inchDisplay width in inches
Display HeightThe distance between the horizontal edges of the display (vertical Display Size). In case of display with rounded edges this refers to the smallest bounding rectangle. 106.33 mm
4.19 inchDisplay height in inches
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 10.79 mm
Display AreaCalculated display area is the product of max. horizontal and vertical display sizes. In case of display with rounded edges or notch this refers to the smallest display bounding rectangle. 6359.9 square millimeter
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 65.9%
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio 0.08307 mm/pixel
Pixel DensityIndicates the number of pixels per inch 306 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color AM-OLEDColor AM-OLED (Active Matrix - Organic Light-emitting Diode) display techology. display
Display SubtypeBrand name of the subtype/technology of the screen like Super AMOLED, SLCD2/3/5, Retina Display, Reality Display, ClearBlack, etc.  Super AM-OLEDSuper AM-OLED is an improved type of AM-OLED display technology developed by Samsung where touch-sensitve layer is integrated into the screen. Super AM-OLED uses Samsung PenTile matrix RGBG subpixel arrangement (2 subpixels)
Display Color DepthColor depth defines how many colors or greyscales can be displayed 24 bit/pixel
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.  Self-illuminatingOLED-based display technologies do not require illumination because they are built up from organic light-emitting diodes.
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Usual schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel  RGBG PenTile Matrix (2 subpixels)PenTile RGBG is a subpixel rendering sceme developed in 1999. In a PenTile matrix each pixel has 2 subpixels. Green subpixel is shared with neighboring pixels so the pixel density can be higher but image quality is lower than RGB's.
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  Corning Gorilla Glass 2Introduced in 2012

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Qualcomm Adreno 225
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) of graphics controller or GPU which independent from the op. memory of the main processor. Graphics controller may have access to the main RAM (shared RAM) too 0.5 MiB

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  MHL (Unspecified)
USB Series Micro-B (Micro-USB)Physical interface of the A/V out port. For example: HDMI D, USB-C, micro-USB or DB25
A/V Out Max. ResolutionThe largest resolution supported by video out  1920x1080 (1080p) FHD

Audio SubsystemAudio Subsystem: 
Audio Channel(s)Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc.  stereo
Audio ControllerManufacturer and part number of the audio controller IC or commercial name of the intellectual property (IP) if the audio controller is the part of a chipset Wolfson WM1811

Sound Recording: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  stereo

Sound Playing: 
Loudspeaker(s):   mono
Audio Output:   3.5mm

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  CDMA 800MHz (BC0, 850)CDMA800 phones support CDMA 800 MHz (CDMA Band Class 0, also known as CDMA850) band (downlink: 860 MHz - 894 MHz, uplink: 815 MHz - 849 MHz). , CDMA 1900MHz (BC1/BC14, PCS)CDMA1900 phones support PCS, also referred as CDMA Band Class 1 band (downlink: 1930 - 1990 MHz, uplink: 1850 - 1910 MHz) and US PCS, also referred as CDMA Band Class 14 band (downlink: 1930 - 1995 MHz, uplink: 1850 - 1915 MHz) , LTE 1900 MHz (Band 2, PCS)LTE1900 phones support LTE 1900 MHz (PCS , also referred as LTE Band 2) band (downlink: 1930 - 1990 MHz, uplink: 1850 - 1910 MHz) bands
Supported Cellular Data LinksList of supported cellular data links and rates.  cdmaOne (IS-95) , CDMA2000 1xRTT (IS-2000) , CDMA2000 1xEV-DO Rel. 0 , CDMA2000 1xEV-DO Revision A , LTE (Cat. unspecified)LTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS). , LTE 100 Mbps / 50 Mbps (Cat. 3)LTE 100.8 Mbps / 50.4 Mbps (Cat. 3) data links
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.  Micro-SIM (3FF)
Cellular AntennaPhysical antenna layout. Most common type: internal. Historic types: fixed external, pull-out, open-out  Internal antenna
Call Alert SoundPolyphonic or monophonic call alert sound (number of chords) 64-chord melody
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc.  Voice transmissionDevice is able to receive and transmit voice over cellular network , Voice speakerDedicated voice speaker is located near to the ear when talking and optimized for the spectrum and peak-to-peak range of the human voice. , Vibrating Alert , Speakerphone , ANCActive noise cancellation (ANC)
Cellular ControllerManufacturer part number of the cellular modem and controller IC or commercial name of the intellectual property (IP) if the function is the part of a chipset Qualcomm MSM8960

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch sensing screen
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect at most  Yes


Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash , microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB. , microSD Extended CapacityA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 3.0 / USB 3.1 Gen 1 / USB 3.2 Gen 1x1Released in November 2008, USB 3.0 specification introduced USB SuperSpeed enabling devices to communicate at 5 Gbit/s. Later renamed as USB 3.1 Gen 1, then USB 3.2 Gen 1x1
USB Hi-Speed (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB Series Micro-B (Micro-USB)
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 4.0
Internal antenna
Bluetooth profilesList of supported Bluetooth profiles e.g. aptX, A2DP, AVRCP, HSP, HID, PBA, PAN, OPP, MAP  A2DPAdvanced Audio Distribution Profile , AVRCPAudio/Video Remote Control Profile (AVRCP)
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  IEEE 802.11aShort range standard, 5 GHz, max. 54 Mbit/s , IEEE 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , IEEE 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , IEEE 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas
Internal antenna
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  DLNADLNA (Digital Living Network Alliance) over Wireless LAN , Wi-Fi TetheringWi-Fi Mobile Hotsport
NFCNear Field Communication is short-range wireless radio data exchange technology based on radio-frequency identification (RFID). This field enumerates the supported NFC technologies.  Yes

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s)Possible protocols: NMEA 0183, SIRF, etc.  GPS (NMEA 0183)NMEA 0183
Satellite Antenna:   Internal antenna
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Assisted GPS , Geotagging
Supported GLONASS protocol(s)GLONASS is a global satellite navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.
Navigation ControllerManufacturer part number of the GNSS (GPS, GLONASS, Galileo and/or BDS) controller IC or commercial name of the intellectual property (IP) if the controller is the part of a chipset Qualcomm MSM8960 gpsOne

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the camera can take a picture 3264x2448 pixel
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 8.0 MP camera
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
4.0 x digital zoomDigital zoom is an image signal processing method which cuts out and enlarges a desired part of the captured image while losing the rest of the image
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  Contrast Detection Autofocus (CD AF)Contrast-detection (CD) is a passive autofocus method without distance measurement which adjusts the optical system until maximum contrast is measured through the lens.
Recordable Image FormatsSupported file formats while capturing photos by primary camera  JPG
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 1920x1080 pixel
30 fpsRecording frame rate when recording video at maximum resolution
Recordable Video FormatsSupported file formats while capturing videos  3GP , MPEG4
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  Yes
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera

Auxiliary Camera: 
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No

Auxiliary Camera No. 2: 
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No

Auxiliary Camera No. 3: 
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No

Auxiliary Camera No. 4: 
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No
Aux. 4 Camera FocusFocusing method of the fourth auxiliary camera  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Secondary Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can take a picture 1600x1200 pixel
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 1.9 MP sec. cam
Secondary Recordable Image FormatsSupported file formats while capturing photos by secondary camera  JPG
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1280x720 pixel
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution

Secondary Auxiliary Camera: 
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Secondary Auxiliary Camera No. 2: 
Sec. Aux. 2 Cam. Image SensorImage sensor technology of sec. auxiliary 2 camera in at least triple lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in compassBuilt-in electroinc compass types: 1D, 2D, 3D  Yes
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Built-in gyroscopeAn internal component that senses the orientation of the device. Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Barometer , Light intensity sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen , Proximity sensorBased on this sensor signal device may control the volume of the voice speaker or dim the display during a call

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 
BatteryBattery technology  Lithium-ion
removablePossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Cell Capacity (1st cell)The nominal mAh capacity of the first battery cell 2100 mAh cell
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 2100 mAh battery

Geographical AttributesGeographical Attributes: 
Market CountriesCountries where the device was officially sold. Overlap is possible.  USA
Market RegionsRegions where the device was officially sold. Overlap is possible.  North America (NA)
Mobile OperatorList of mobile operators (carriers) or distributors which sold the device in their own network Sprint Nextel CorporationSprint Nextel Corporation

Datasheet AttributesDatasheet Attributes: 
Related Page:  URL
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2012-06-30 12:49
 

Samsung SPH-L710 Galaxy S III LTE Detailed Tech Specs

Samsung SPH-L710 Galaxy S III LTE Detailed Tech Specs
Platform: android A/V Out: mhl Audio Output: audio_jack Supported Cellular Data Links: cdma Supported Cellular Data Links: lte Complementary Phone Services: phone Complementary Phone Services: vibration Complementary Phone Services: speakerphone Expansion Interfaces USB: usb3 Bluetooth Wireless LAN NFC Supported GPS protocol(s) Supported GLONASS protocol(s) Number of effective pixels: 8.0 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 1.9 MP sec. cam Built-in compass Built-in accelerometer Built-in gyroscope Additional sensors: barometer

Predecessor Model

Samsung SPH-L700 Galaxy Nexus 4G LTE (Samsung Prime)
Samsung SPH-L700 Galaxy Nexus 4G LTE (Samsung Prime)
SPHL700, 67.94x135.5x9.47 mm, Google Android 4.0.4 (Ice Cream Sandwich), Texas Instruments OMAP 4460, 1 GiB RAM, 32 GB ROM, 4.6 inch, 720x1280, 5.0 MP camera, 1.3 MP sec. cam, 1850 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

High Resolution Photos

samsung sph-l710 galaxy s iii whiteangle
samsung sph-l710 galaxy s iii whiteback
samsung sph-l710 galaxy s iii whiteside
samsung sph-l710 galaxy s iii bluefront
samsung sph-l710 galaxy s iii blueangle

Software Updates / Related Files

Samsung SPH-L710 Galaxy S III Android 4.0.4 OTA System Update VPLF9
Samsung SPH-L710 Galaxy S III Android 4.0.4 OTA System Update VPLF9
2012 Jun 29, Samsung | All detailsAll details

Samsung SPH-L710 Galaxy S III Android 4.1.1 OTA System Update VPLJ7
Samsung SPH-L710 Galaxy S III Android 4.1.1 OTA System Update VPLJ7
2012 Oct 25, Samsung | All detailsAll details

Samsung SPH-L710 Galaxy S III Android 4.1.2 OTA System Update WWMB3
Samsung SPH-L710 Galaxy S III Android 4.1.2 OTA System Update WWMB3
2013 Mar 6, Samsung | All detailsAll details

Samsung SPH-L710 Galaxy S III Android 4.1.2 OTA System Update VPBMD4
Samsung SPH-L710 Galaxy S III Android 4.1.2 OTA System Update VPBMD4
2013 Apr 24, Sprint | All detailsAll details

Samsung SPH-L710 Galaxy S III Android 4.3 OTA System Update VPBMK3
Samsung SPH-L710 Galaxy S III Android 4.3 OTA System Update VPBMK3
2013 Dec 10, Sprint | All detailsAll details

Compare All Software Updates / Related Files side by side

Comparison

Quad-core and dual-core Galaxy S III variants - updated
Samsung Galaxy S III LTE SC-06D, Samsung GT-i9300 Galaxy S III 64GB, Samsung GT-i9308 Galaxy S3, Samsung SCH-i939 Galaxy S III (Samsung Midas), Samsung SCH-R530 Galaxy S III LTE, Samsung SGH-i747 Galaxy S III LTE, Samsung SGH-iT999 Galaxy S III, Samsung SHV-E210S Galaxy S III LTE, Samsung SHW-M440S Galaxy S 3, Samsung SPH-L710 Galaxy S III LTE, T-Mobile Samsung SGH-T999V Galaxy S III, Verizon Samsung SCH-i535 Galaxy S3 | All detailsAll details

See also

Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB (Samsung B6)
Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB (Samsung B6)
F741UZOEXAA, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB (Samsung B6)
Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB (Samsung B6)
F741UZSAXAA, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741R4 (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741R4 (Samsung B6)
F741ULGEUSC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741R4 (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741R4 (Samsung B6)
F741UZSAUSC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741V (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741V (Samsung B6)
F741ULBEVZW, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741V (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741V (Samsung B6)
F741UZSAVZW, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741T (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741T (Samsung B6)
F741UZYEXAU, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741T (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741T (Samsung B6)
F741ULGAXAU, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741A (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741A (Samsung B6)
F741ULBEATT, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741A (Samsung B6)
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741A (Samsung B6)
F741UZSAATT, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 512GB (Samsung B6)
Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 512GB (Samsung B6)
F741WZYEXAC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 256GB (Samsung B6)
Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 256GB (Samsung B6)
F741WAKAXAC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 512GB (Samsung B6)
Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 512GB (Samsung B6)
F741NZOEKOO, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 256GB (Samsung B6)
Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 256GB (Samsung B6)
F741NLBAKOO, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 512GB (Samsung B6)
Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 512GB (Samsung B6)
F7410ZWEBRI, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 256GB (Samsung B6)
Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 256GB (Samsung B6)
F7410LGATGY, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SCG29 (Samsung B6)
Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SCG29 (Samsung B6)
F741JZYAKDI, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB SCG29 (Samsung B6)
Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB SCG29 (Samsung B6)
F741JZSEKDI, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741D Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SC-54E (Samsung B6)
Samsung SM-F741D Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SC-54E (Samsung B6)
F741DLBADCM, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741Q Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB (Samsung B6)
Samsung SM-F741Q Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB (Samsung B6)
F741QZSESJP, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

More options

See default datasheet
Use the following link to refer to this datasheet:
Did you notice a typo on this datasheet? Click here to report and we will fix it.
You are here: Device Specs \ Samsung SPH-L710 Galaxy S III LTE Detailed Tech Specs
Jump to top | Database Licensing | Contact | Banner & Text Link Advertising | Help | Sitemap | Privacy Policy

(c) 2006 -2024 PhoneDB. All rights reserved.