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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer NEC
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated LAVIE TAB10/F02 2023 WiFi 32GB PC-TAB10F02
BriefBrief Introduction: One or two sentences which enumerates some important attributes of the specifc device variant described by this datasheet
Simply point your face at the front camera to quickly sign in and start using the app
ReleasedFirst official market release date in (year, month) 2023 Mar
AnnouncedDate of the official announcement (year, month) 2023 Feb
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  TabletHandheld touchscreen mobile computer which is able to natively run third-party applications and does not support voice calling without headset or speakerphone.
List of Additional FeaturesComma separated list of low priority special features which are not included in other fields
Dolby Atmos sound

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 239.84 mm
9.44 inchWidth measured in inches
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 158.62 mm
6.24 inchHeight measured in inches
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 12 mm
0.47 inchesDepth measured in inches
Typical depthThis thickness value can be measured at the most points of the device 8.5 mm
Bounding VolumeThe volume of the smallest cuboid which can bound the device in cubecentimetres 456.5 ccm
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 460 g
16.23 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Google Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 11 (R)Google Android 11 (R)
Software ExtrasNavigation software, voice recognition, face recognition, personal assistant app, etc.  Face RecognitionFace identification by built-in camera

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 1800 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors UNISOC Tiger T610, 2020, 64 bit, octa-core, 12 nm, ARM Mali-G52 GPUUNISOC Tiger T610, 2020, 64 bit, octa-core, 12 nm, ARM Mali-G52 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  LPDDR4x SDRAM
1600 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes) 3072 MiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  eMMC 5.1Complies with embedded MMC 5.1 specification released in 2015
Non-volatile Memory CapacityNon-volatile memory in mebibytes (binary megabytes).2GB = 1907.3MiB, 4GB = 3814.7MiB, 8GB = 7629.4MiB, 16GB = 15258.8MiB, 32GB = 30517.6MiB, 64GB = 61035.2MiB, 128GB = 122070.3MiB, 256GB = 244140.6MiB, 512GB = 488281.3MiB, 1TB = 953674MiB, 2TB = 1907349Mi 30517 MiB non-volatile

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 256 mm
10.1 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 1920x1200
2304000 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display WidthThe distance between the vertical edges of the display (horizontal display size). In case of display with rounded edges this refers to the smallest bounding rectangle. 217.09 mm
8.55 inchDisplay width in inches
Display HeightThe distance between the horizontal edges of the display (vertical Display Size). In case of display with rounded edges this refers to the smallest bounding rectangle. 135.68 mm
5.34 inchDisplay height in inches
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 22.75 mm
Display AreaCalculated display area is the product of max. horizontal and vertical display sizes. In case of display with rounded edges or notch this refers to the smallest display bounding rectangle. 29454.4 square millimeter
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 77.4%
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio 0.11307 mm/pixel
Pixel DensityIndicates the number of pixels per inch 225 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996. display
Display Color DepthColor depth defines how many colors or greyscales can be displayed 24 bit/pixel
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Display Dynamic Range DepthBit depth of the dynamic range defines the luminance ratio between the brightest and the darkest state of a pixel (HDR10: 10 bit, HDR10+: 12 bit) 8 bit/pixel
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.  Yes
Display Light Reflection ModeThe ratio between reflected and transmitted light depends on reflection mode thus display technology. Possible options: transflective, reflective, transmissive, etc.  Yes
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Usual schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel  RGB Matrix (3 subpixels)Each pixel has 3 subpixel (Red, Greed, Blue) with the same size. The subpixel order is often R-G-B but B-G-R is also used.
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  No

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset ARM Mali-G52MP2
GPU Clock:  614 MHz

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 
Audio Channel(s)Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc.  stereo

Sound Recording: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  mono
Microphone InputThis jack allows the user to connect external microphone to the device  3.5mm

Sound Playing: 
Loudspeaker(s):   stereo
Audio Output:   3.5mm

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  No

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch sensing screen
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect at most  10-point


Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash , microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB. , microSD Extended CapacityA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Hi-Speed (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB On-The-Go 1.3 , USB Power DeliveryDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V. , USB Power Delivery 2.0Device which meets USB Power Delivery 2.0 is able to supply current from 3 A to 5 A for the client device at 20V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB Type-C reversible
USB2 Services:   USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB Power DeliveryDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V.
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 5.0Released in Dec, 2016
Internal antenna
Bluetooth profilesList of supported Bluetooth profiles e.g. aptX, A2DP, AVRCP, HSP, HID, PBA, PAN, OPP, MAP  A2DPAdvanced Audio Distribution Profile , A2DP with aptX codecAdvanced Audio Distribution Profile with aptX codec , A2DP with aptX HD codecAdvanced Audio Distribution Profile with aptX High Definition codec , AVRCPAudio/Video Remote Control Profile (AVRCP) , GAVDPGeneric Audio/Video Distribution Profile (GAVDP) , HSPHeadset Profile (HSP) , MAPMessage Access Profile (MAP) , OPPObject Push Profile (OPP) , PANPersonal Area Networking Profile (PAN) , PBAPhone Book Access Profile (PBA)
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  IEEE 802.11aShort range standard, 5 GHz, max. 54 Mbit/s , IEEE 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , IEEE 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , IEEE 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas , IEEE 802.11ac2.4 GHz (ISM band) or optional 5 GHz support (4915...5825 MHz), max. 1300 Mbit/s thanks to MIMO antennas
Internal antenna
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  Wi-Fi TetheringWi-Fi Mobile Hotsport

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s)Possible protocols: NMEA 0183, SIRF, etc.  GPS (NMEA 0183)NMEA 0183
Satellite Antenna:   Internal antenna
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Geotagging
Navigation ControllerManufacturer part number of the GNSS (GPS, GLONASS, Galileo and/or BDS) controller IC or commercial name of the intellectual property (IP) if the controller is the part of a chipset UNISOC T610

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Image Sensor FormatThe format of the image sensor determines the physical dimensions of the image sensor 1/4.00
Image Sensor Pixel SizePixel size of the primary camera sensor 1.12 micrometer
Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the camera can take a picture 3264x2448 pixel
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 8.0 MP camera
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  No
Recordable Image FormatsSupported file formats while capturing photos by primary camera  JPG
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 1280x720 pixel
30 fpsRecording frame rate when recording video at maximum resolution
Recordable Video FormatsSupported file formats while capturing videos  3GP , MPEG4
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  No
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  HDR photoHigh dynamic range image recording , Burst mode , Face detection , Face tagging , Smile detection

Auxiliary Camera: 
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No

Auxiliary Camera No. 2: 
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No

Auxiliary Camera No. 3: 
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No

Auxiliary Camera No. 4: 
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No
Aux. 4 Camera FocusFocusing method of the fourth auxiliary camera  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Secondary Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can take a picture 2560x1920 pixel
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 4.9 MP sec. cam
Secondary Recordable Image FormatsSupported file formats while capturing photos by secondary camera  JPG
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution
Secondary Recordable Video FormatsSupported file formats while capturing videos by the secondary camera  3GP
Secondary Camera Extra FunctionsPopular extra features of the secondary camera: Face detection, HDR photo, Selfie Panorama, Smile detection, Face Retouch / Face Beautification  Burst mode , Face detection , Face tagging , Smile detection

Secondary Auxiliary Camera: 
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Secondary Auxiliary Camera No. 2: 
Sec. Aux. 2 Cam. Image SensorImage sensor technology of sec. auxiliary 2 camera in at least triple lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Hall sensor , Light intensity sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen , Proximity sensorBased on this sensor signal device may control the volume of the voice speaker or dim the display during a call

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  5 Protected against dust with limited ingress (no harmful deposit)
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  2 Protected against direct sprays of water up to 15 degrees from the vertical

Power SupplyPower Supply: 
BatteryBattery technology  Lithium-ion polymer (LiPo)
built-inPossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Cell Voltage (1st cell)Idle voltage of the charged battery cell 3.86 Volts
Nominal Cell Capacity (1st cell)The nominal mAh capacity of the first battery cell 5100 mAh cell
Nominal Battery VoltageIf there are more than 1 cells in the battery in series connection the nominal resulting battery voltage is the sum of voltage of cells 3.86 Volts
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 5100 mAh battery
Nominal Battery EnergyThe product of battery capacity and nominal voltage determines the maximal nominal stored energy in the battery 19.69 Wh
Estimated Battery LifeEstimated always-on battery life of the device in case of common usage conditions 9.0 hours
Estimated Average CurrentEstimated average current is derived from battery life and battery capacity. This current is consumed while the device is used in the following state: screen backlight on (mid-level), phone (if any) on, no phone calls, no multimedia, continuous user input 567 mA

Geographical AttributesGeographical Attributes: 
Market CountriesCountries where the device was officially sold. Overlap is possible.  Japan
Market RegionsRegions where the device was officially sold. Overlap is possible.  Asia
PriceGross end user price recommended by the manufacturer on the day of product release 34960
Japanese YenCurrency of the given gross end user price

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2024-06-01 21:04
 

NEC LAVIE TAB10/F02 2023 WiFi 32GB PC-TAB10F02 Detailed Tech Specs

NEC LAVIE TAB10/F02 2023 WiFi 32GB PC-TAB10F02 Detailed Tech Specs
Platform: android Microphone Input: audio_jack Expansion Interfaces USB Services: usb_otg USB Connector: usb_c Bluetooth Wireless LAN Supported GPS protocol(s) Number of effective pixels: 8.0 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 4.9 MP sec. cam Built-in accelerometer

See also

NEC LAVIE Tab T11 2023 11.2 WiFi 128GB TAB11/Q01 (NEC T1195)
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NEC LAVIE Tab T11 2023 11.2 WiFi 256GB PC-T1195/FAS (NEC T1195)
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263.66x166.67x6.8 mm, Google Android 12 (S), MediaTek Kompanio 1300T MT8797, 8 GiB RAM, 256 GB ROM, 11.2 inch, 1536x2560, 13.0 MP camera, 8.0 MP sec. cam, 8000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

NEC LAVIE Tab T11 2024 WiFi 128GB PC-T1155/HAS (NEC T1165)
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255.3x166.9x7.2 mm, Google Android 13 (Tiramisu), MediaTek Helio G88 MT6769H, 4 GiB RAM, 128 GB ROM, 11 inch, 1920x1200, 8.0 MP camera, 8.0 MP sec. cam, 7040 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

NEC LAVIE Tab T11 2023 11.5 WiFi 128GB TAB11/202 (NEC T1175)
Click here to view image
269.1x169.4x7.4 mm, Google Android 12 (S), MediaTek Helio G99 MT6789, 4 GiB RAM, 128 GB ROM, 11.5 inch, 2000x1200, 13.0 MP camera, 8.0 MP sec. cam, 7700 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

NEC LAVIE Tab T11 2023 11.5 WiFi 128GB PC-T1175/FAS (NEC T1175)
Click here to view image
269.1x169.4x7.4 mm, Google Android 12 (S), MediaTek Helio G99 MT6789, 6 GiB RAM, 128 GB ROM, 11.5 inch, 2000x1200, 13.0 MP camera, 8.0 MP sec. cam, 7700 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

NEC LAVIE Tab T11 2024 WiFi 128GB PC-T1165/KAS (NEC T1165)
NEC LAVIE Tab T11 2024 WiFi 128GB PC-T1165/KAS (NEC T1165)
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NEC LAVIE Tab T11 2024 WiFi 64GB TAB11/F01 (NEC T1165)
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NEC LAVIE Tab T11d 2024 WiFi 64GB (NEC T1165)
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NEC LAVIE Tab T10d 2023 WiFi 64GB PC-T1055
NEC LAVIE Tab T10d 2023 WiFi 64GB PC-T1055
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NEC LaVie Tab E TE507
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NEC Medias X N-04E
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