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Processor Specs: Referred (not editable) comparison sheet [2]

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Samsung Exynos 8 Octa 8890
Samsung Exynos 9 Octa 9810
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Samsung Exynos 8 Octa 8890
Samsung Exynos 9 Octa 9810
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Generel CharacteristicsGenerel Characteristics
Year Released 2016 2018
FunctionMain function of the component Multi-core Application Processor with Modem Multi-core Application Processor with Modem

ArchitectureArchitecture
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit 64 bit
Supported Instruction Set(s) ARMv8-A (A32, A64) ARMv8-A (A32, A64)
Type of processor core(s)Type and allocation of processor core(s) 4x Samsung Exynos M1 + 4x ARM Cortex-A53 MPcore 4x Samsung Exynos M3 + 4x ARM Cortex-A55 MPcore
Number of processor core(s) octa-core octa-core

BusesBuses
Memory Interface(s) LPDDR2 SDRAM, DDR3L SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM LPDDR4x SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 1794 MHz 1794 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit 16 bit
Number of data bus channels 2 ch 4 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 28.7 Gbyte/s 28.7 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory eMMC 5.1, NAND Flash Interface, SATA, UFS 2.0 NAND Flash Interface, SATA, UFS 2.1

Clock FrequenciesClock Frequencies
Internal Systembus Clock 2290 MHz
Recommended Maximum Clock Frequency 2600 MHz max. 2704 MHz max.

Cache MemoriesCache Memories
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 2560 Kbyte L2
Total L3 Cache 4096 Kbyte L3



Technology and PackagingTechnology and Packaging
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 14 nm 10 nm
Semiconductor Technology CMOS CMOS
FabPlant which fabricates the semiconductor component Samsung Samsung

Graphical SubsystemGraphical Subsystem
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). ARM Mali-T880 GPU ARM Mali-G72 GPU
Number of GPU cores 12-core GPU 18-core GPU
GPU Clock 650 MHz GPU 572 MHz GPU

Cellular CommunicationCellular Communication
Supported Cellular Data LinksList of supported cellular data links CSD, GPRS, EDGE, UMTS, HSDPA, TD-SCDMA, LTE, LTE 100/50, LTE 150/50, LTE 300/50, LTE 300/100, LTE 400/150, LTE 600/50, LTE 600/100 data links CSD, GPRS, EDGE, EDGE MSC32, UMTS, HSUPA 5.8, HSDPA, HSPA+ 21.1, DC-HSDPA 42.2, cdmaOne, CDMA2000 1x, CDMA2000 1xEV-DO, CDMA2000 1xEV-DO Rev A, CDMA2000 1xEV-DO Rev B, TD-SCDMA, LTE, LTE 100/50, LTE 150/50, LTE 300/50, LTE 300/75, LTE 300/100, LTE 400/150, LTE 450/50, LTE 450/100, LTE 600/50, LTE 600/100, LTE 1000/100, LTE 1200/200 data links

Additional InformationAdditional Information
Special Features Quad 2.29 GHz Samsung Exynos M1 (Mongoose) Harvard Superscalar processor cores + Quad 1.586 GHz ARM Cortex-A53 Harvard Superscalar processor cores, HMP, ARM big.LITTLE architecture, Samsung Coherent Interconnect, ARM TrustZone, ARM NEON SIMD engine, embedded Samsung Exynos Modem GSM /.. Quad Samsung Exynos M3 Harvard Superscalar processor cores (up to 2.7 GHz, 512 Kbyte L2 cache per core) + Quad ARM Cortex-A55 (up to 1.95 GHz, 512 Kbyte total L3 cache) Harvard Superscalar processor cores, HMP, ARM big.LITTLE architecture,..

Datasheet AttributesDatasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary Preliminary
AddedThe exact time of the datasheet addition 2015-11-13 21:46 2017-11-13 14:56

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