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Processor Specs: Referred (not editable) comparison sheet [2]

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Qualcomm Snapdragon 820 APQ8096
Qualcomm Snapdragon 660 SDM660
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Qualcomm Snapdragon 820 APQ8096
Qualcomm Snapdragon 660 SDM660
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Generel CharacteristicsGenerel Characteristics
Year Released 2015 2017
FunctionMain function of the component Application Processor Multi-core Application Processor with Modem

ArchitectureArchitecture
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit 64 bit
Supported Instruction Set(s) ARMv8-A (A32, A64) ARMv8-A (A32, A64)
Type of processor core(s)Type and allocation of processor core(s) 4x Qualcomm Kryo 8x Qualcomm Kryo 260
Number of processor core(s) quad-core octa-core

BusesBuses
Memory Interface(s) LPDDR4 SDRAM LPDDR4 SDRAM, LPDDR4x SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 1866 MHz 1866 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit 32 bit
Number of data bus channels 2 ch 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 29.86 Gbyte/s 29.86 Gbyte/s

Clock FrequenciesClock Frequencies
Recommended Minimum Clock Frequency 1593 MHz min.
Recommended Maximum Clock Frequency 2150 MHz max. 2200 MHz max.

Cache MemoriesCache Memories
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 1536 Kbyte L2



Technology and PackagingTechnology and Packaging
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 14 nm 14 nm
Semiconductor Technology CMOS CMOS
FabPlant which fabricates the semiconductor component TSMC Samsung

Graphical SubsystemGraphical Subsystem
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 530 GPU Qualcomm Adreno 512 GPU
GPU Clock 624 MHz GPU 650 MHz GPU
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) 1 MiB 0.25 MiB

Cellular CommunicationCellular Communication
Supported Cellular Data LinksList of supported cellular data links No CSD, GPRS, EDGE, UMTS, HSUPA, HSUPA 11.5, HSDPA, DC-HSDPA 42.2, CDMA2000 1x, CDMA2000 1xEV-DO, CDMA2000 1xEV-DO Rev A, CDMA2000 1xEV-DO Rev B, TD-SCDMA, LTE, LTE 100/50, LTE 150/50, LTE 300/50, LTE 300/100, LTE 400/150, LTE 450/100, LTE 600/100 data links

Satellite NavigationSatellite Navigation
Supported GPS protocol(s) Yes Yes
Supported Galileo service(s)Galileo is a global satellite  navigation system operated by European Union and the European Space Agency. Yes Yes
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia. Yes Yes
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS. BeiDou-2 BeiDou receiver Yes

Additional InformationAdditional Information
Special Features dual Qualcomm Kryo Harvard Superscalar cores (up to.. quad Qualcomm Kryo 260 (up to 2210 MHz)..

Datasheet AttributesDatasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary Preliminary
AddedThe exact time of the datasheet addition 2017-02-27 20:23 2017-05-21 22:29

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