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Processor Specs: Referred (not editable) comparison sheet [2]

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Qualcomm Snapdragon 620 MSM8976 / Snapdragon 652
Qualcomm Snapdragon 660 SDM660
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Qualcomm Snapdragon 620 MSM8976 / Snapdragon 652
Qualcomm Snapdragon 660 SDM660
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Generel CharacteristicsGenerel Characteristics
Year Released 2015 2017
FunctionMain function of the component Multi-core Application Processor with Modem Multi-core Application Processor with Modem

ArchitectureArchitecture
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit 64 bit
Supported Instruction Set(s) ARMv8 (A32, A64) ARMv8-A (A32, A64)
Type of processor core(s)Type and allocation of processor core(s) 4x ARM Cortex-A72 MPcore + 4x ARM Cortex-A53 MPcore 8x Qualcomm Kryo 260
Number of processor core(s) octa-core octa-core

BusesBuses
Memory Interface(s) LPDDR3 SDRAM LPDDR4 SDRAM, LPDDR4x SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 933 MHz 1866 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit 32 bit
Number of data bus channels 2 ch 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 14.93 Gbyte/s 29.86 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory eMMC 5.1 eMMC 5.1, UFS 2.1

Clock FrequenciesClock Frequencies
Recommended Maximum Clock Frequency 1800 MHz max. 2200 MHz max.

Cache MemoriesCache Memories
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 1024 Kbyte L2



Technology and PackagingTechnology and Packaging
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 28 nm 14 nm
Semiconductor Technology CMOS CMOS
FabPlant which fabricates the semiconductor component TSMC Samsung

Graphical SubsystemGraphical Subsystem
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 510 GPU Qualcomm Adreno 512 GPU
GPU Clock 650 MHz GPU
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) 0.25 MiB 0.25 MiB

Cellular CommunicationCellular Communication
Supported Cellular Data LinksList of supported cellular data links CSD, GPRS, EDGE, UMTS, HSUPA, HSDPA, HSPA+ 42.2, DC-HSDPA 42.2, cdmaOne, CDMA2000 1x, CDMA2000 1xEV-DO, CDMA2000 1xEV-DO Rev A, CDMA2000 1xEV-DO Rev B, TD-SCDMA, LTE, LTE 300/50 data links CSD, GPRS, EDGE, UMTS, HSUPA, HSUPA 11.5, HSDPA, DC-HSDPA 42.2, CDMA2000 1x, CDMA2000 1xEV-DO, CDMA2000 1xEV-DO Rev A, CDMA2000 1xEV-DO Rev B, TD-SCDMA, LTE, LTE 100/50, LTE 150/50, LTE 300/50, LTE 300/100, LTE 400/150, LTE 450/100, LTE 600/100 data links

Additional InformationAdditional Information
Special Features quad 64-bit ARM Cortex A72 Harvard Superscalar cores (max. 1.8 GHz, 1024 Kbyte L2 cache) + quad 64-bit ARM Cortex-A53 MPcore Harvard Superscalar core (max. 1.2 GHz, 512 Kbyte L2 cache), HMP, eMMC 5.1 interface, max. 700 MHz Hexagon.. quad Qualcomm Kryo 260 (up to 2210 MHz) + quad Qualcomm Kryo 260 (up to 1843 MHz) Harvard Superscalar cores, Hexagon 680 DSP, Qualcomm X12 LTE Modem, CDMA 2000 1x Adv./DO Rel 0., Rev. A/B, SVDO-DB, GSM, GPRS, EDGE, UMTS,..

Datasheet AttributesDatasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary Preliminary
AddedThe exact time of the datasheet addition 2015-02-15 12:16 2017-05-21 22:29

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