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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Samsung
Type Exynos 3 Dual 3250
Year Released 2014
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x ARM Cortex-A7 MPcore

BusesBuses: 
Memory Interface(s):   Yes
Number of data bus channels 1 ch
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  Yes


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 1000 MHz max.

Cache MemoriesCache Memories: 

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 28 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component Samsung

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). ARM Mali-400 GPU
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) 0.25 MiB

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Communication InterfacesCommunication Interfaces: 
Supported USB Specification:   No
Bluetooth supportThis field specifies the supported BT version  No
Wireless LAN supportThis field enumerates the supported Wi-Fi protocols  No
Supported Audio/Video Interface:   No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s):   No

Additional InformationAdditional Information: 
Special Features
dual ARM Cortex-A7 Harvard Superscalar processor core, Multi-layer AHB/AXI bus, ARM TrustZone, ARM NEON SIMD engine, ARM Mali-400 GPU

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Incomplete
AddedThe exact time of the datasheet addition 2014-05-18 10:19
 
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