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Qualcomm Snapdragon 600 APQ8064T (Snapdragon 600)

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Generel Characteristics: 
DesignerCompany which designed the semiconductor component Qualcomm
Type Snapdragon 600 APQ8064T
FabPlant which fabricates the semiconductor component TSMC
Codename Snapdragon 600
Year Released 2013
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 11 pipeline stages
Type of processor core(s)Type and allocation of processor core(s) 4x Qualcomm Krait 300
Number of processor core(s) quad-core


BusesBuses: 
Memory Interface(s):   LPDDR3 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 533 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 8.53 Gbyte/s

Clock FrequenciesClock Frequencies: 
Recommended Minimum Clock Frequency 1500 MHz min.
Recommended Maximum Clock Frequency 1700 MHz max.

Cache MemoriesCache Memories: 
L0 Instruction Cache per CoreCapacity of level 0 instruction cache per processor core 4 Kbyte L0 I-Cache
L0 Data Cache per CoreCapacity of level 0 data cache per processor core 4 Kbyte L0 D-Cache
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 16 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 16 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 2048 Kbyte L2

Technology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 28 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor

Additional Features: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 320 GPU
GPU Clock 400 MHz
Special Features 4x Qualcomm Krait 300 Harvard Superscalar processor core,..
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia.  Yes


Datasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2013-02-18 17:22
 
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