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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Qualcomm
Type Snapdragon S4 APQ8030
Year Released 2012
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 11 pipeline stages
Type of processor core(s)Type and allocation of processor core(s) 2x Qualcomm Krait
Number of processor core(s) dual-core

BusesBuses: 
Memory Interface(s):   LPDDR2 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 533 MHz
Number of data bus channels 1 ch
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  Yes


Clock FrequenciesClock Frequencies: 
Recommended Minimum Clock Frequency 1000 MHz min.
Recommended Maximum Clock Frequency 1200 MHz max.

Cache MemoriesCache Memories: 
L0 Instruction Cache per CoreCapacity of level 0 instruction cache per processor core 4 Kbyte L0 I-Cache
L0 Data Cache per CoreCapacity of level 0 data cache per processor core 4 Kbyte L0 D-Cache
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 16 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 16 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 1024 Kbyte L2

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 28 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 305 GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Additional InformationAdditional Information: 
Special Features
2x Qualcomm Krait Harvard Superscalar core, Hexagon QDSP6 500MHz, qHD (540x960) display support, 20 MP camera support, 1080p video encode/decode, gpsOneGen 8A with GLONASS

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2012-07-02 11:17
 
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