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IntroductionIntroduction: 

BriefBrief Introduction: One or two sentences which enumerates some important attributes of the specifc device variant described by this datasheet WiFi-only 6 / 128 GB variant of high-end MatePad Pro tablet
BrandBrand name of the device. This may match with the manufacturer Huawei
ModelOne or more (separated by /) specific model name identifies this device. This field may include model code too. MatePad Pro Standard Edition WiFi 128GB MRX-W09
ReleasedFirst official market release date in (year, month) 2019 Nov
AnnouncedDate of the official announcement (year, month) 2019 Nov
Hardware DesignerThe company which designed this device Huawei
ManufacturerThe company which produces this device Huawei
CodenameThe codename internally identified the design project of this product Huawei Marx
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc.  Active stylusStylus in default package
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  TabletHandheld touchscreen mobile computer which is able to natively run third-party applications and does not support voice calling without headset or speakerphone.
List of Additional FeaturesComma separated list of low priority special features which are not included in other fields 12-bit Huawei M-Pencil, DCI-P3

Physical AttributesPhysical Attributes: 

WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 159 mm
6.26 inchWidth measured in inches
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 245 mm
9.65 inchHeight measured in inches
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 7.99 mm
0.31 inchesDepth measured in inches
Typical depthThis thickness value can be measured at the most points of the device 7.2 mm
Bounding VolumeThe volume of the smallest cuboid which can bound the device in cubecentimetres 311.3 ccm
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 460 g
16.23 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 

PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Google Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 10 (Q)Google Android 10 (Q)
EMUI 10.0.1Subversion, update version, user interface, defualt language, etc.
Software ExtrasNavigation software, voice recognition, face recognition, personal assistant app, etc.  Voice Command , Navigation softwarepre-installed , Intelligent personal assistantLearning personal assistant based on artificial intelligence (AI) , Face RecognitionFace identification by built-in camera

Application processor, ChipsetApplication processor, Chipset: 

CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 2860 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors HiSilicon Honor KIRIN990, 2019, 64 bit, octa-core, 7 nm, ARM Mali-G76 GPUHiSilicon Honor KIRIN990, 2019, 64 bit, octa-core, 7 nm, ARM Mali-G76 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  LPDDR4x SDRAM
2133 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes) 6144 MiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM
Non-volatile Memory CapacityPrimary non-volatile memory in mebibytes (binary megabytes). 2GB = 1907.3MiB, 4GB = 3814.7MiB, 8GB = 7629.4MiB, 16GB = 15258.8MiB, 32GB = 30517.6MiB, 64GB = 61035.2MiB, 128GB = 122070.3MiB, 256GB = 244140.6MiB, 512GB = 488281.3MiB, 1024GB = 976562.5MiB 122070 MiB non-volatile

DisplayDisplayAll parameters that related to display

ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 2560x1600
4096000 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 274.3 mm
10.8 inchDisplay Diagonal in inches
Display WidthThe distance between the vertical edges of the display (horizontal display size). In case of display with rounded edges this refers to the smallest bounding rectangle. 232.61 mm
9.16 inchDisplay width in inches
Display HeightThe distance between the horizontal edges of the display (vertical Display Size). In case of display with rounded edges this refers to the smallest bounding rectangle. 145.38 mm
5.72 inchDisplay height in inches
Display AreaCalculated display area is the product of max. horizontal and vertical display sizes. In case of display with rounded edges or notch this refers to the smallest display bounding rectangle. 33815.9 square millimeter
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 86.8%
Display HoleNumber of in-display camera or sensor holes 1 hole
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio 0.09086 mm/pixel
Pixel DensityIndicates the number of pixels per inch 280 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996. display
Display Color DepthColor depth defines how many colors or greyscales can be displayed 24 bit/pixel
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.  LEDLight-emitting Diodes
Display Light Reflection ModeThe ratio between reflected and transmitted light depends on reflection mode thus display technology. Possible options: transflective, reflective, transmissive, etc.  transflectiveTransflective LCD has medium reflectance factor. Hence it reflects and transmits the incident ambient light. It does not need backlighting and well readable in bright sunlight but can be backlit in dark ambient conditions without reducing readibility.
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Usual schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel  RGB Matrix (3 subpixels)Each pixel has 3 subpixel (Red, Greed, Blue) with the same size. The subpixel order is often R-G-B but B-G-R is also used.
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  Yes

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset ARM Mali-G76MP16
GPU Clock 600 MHz

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 

Audio Channel(s)Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc.  stereo

Sound Recording: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  54.1

Sound Playing: 
Loudpeaker(s):   44.0 Surround sound or four microphones for noise cancellation
Audio Output:   USB Type-C

Cellular PhoneCellular Phone: 

Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  No

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No
Internal antenna

Control PeripheralsControl Peripherals: 

Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch sensing screen
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect  10-point
KeyboardConventional input peripheral which allows the user to enter characters by pressing a dedicated key  Attachable QWERTY
Keyboard BacklightPhones and some palmtops, netbooks, notebooks, rugged computers have keyboard backlighting to help the user with typing in dim ambient conditions  Aut. keyboard backlight (upon press of key/low light)Automatic keyboard backlight (upon press of any key) with ambient light intensity sensor


Communication InterfacesCommunication Interfaces: 

Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  nanoSD (NM)Nano Memory card or NM card. From Oct 2018. Up to 256 GB
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 3.1 (USB 3.2 Gen 2)Released in July, 2013, USB 3.1 specification introduced USB SuperSpeed+ enabling devices to communicate at 10 Gbit/s data rate. USB 3.1 standard is backward compatible with USB 2.0 and 3.0.
USB Hi-Speed (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB On-The-Go 1.3 , USB Power DeliveryDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB Type-C reversible
Max. Charging Power:  20.0 W
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 5.1Released in Jan, 2019
Internal antenna
Bluetooth profilesList of supported Bluetooth profiles e.g. aptX, A2DP, AVRCP, HSP, HID, PBA, PAN, OPP, MAP  A2DPAdvanced Audio Distribution Profile , A2DP with aptX codecAdvanced Audio Distribution Profile with aptX codec , A2DP with aptX HD codecAdvanced Audio Distribution Profile with aptX High Definition codec , AVRCPAudio/Video Remote Control Profile (AVRCP) , GAVDPGeneric Audio/Video Distribution Profile (GAVDP) , HFPHands-Free Profile (HFP) , HIDHuman Interface Device Profile (HID) , HSPHeadset Profile (HSP) , MAPMessage Access Profile (MAP) , OPPObject Push Profile (OPP) , PANPersonal Area Networking Profile (PAN) , PBAPhone Book Access Profile (PBA) , SAPSIM Access Profile (SAP)
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  IEEE 802.11b , IEEE 802.11g , IEEE 802.11n , IEEE 802.11ac
Internal antenna
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  Wi-Fi Direct , Wi-Fi TetheringWi-Fi Mobile Hotsport , WiDiIntel Wireless Display

Multimedia BroadcastMultimedia Broadcast: 

FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No

Satellite NavigationSatellite Navigation: 

Supported GPS protocol(s)Possible protocols: NMEA 0183, SIRF, etc.  GPS (NMEA 0183)NMEA 0183
GPS Antenna:   Internal antenna
Complementary GPS ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Simultaneous GPS (S-GPS) , Geotagging , QuickGPS , QZSSQuasi-Zenith Satellite System
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia.  Yes
Supported Galileo service(s)Galileo is a global satellite  navigation system operated by European Union and the European Space Agency.  Yes
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  BeiDou-2BeiDou-2 (COMPASS) BeiDou receiver
Navigation ControllerManufacturer part number of the GNSS (GPS, GLONASS, Galileo and/or BDS) controller IC or commercial name of the intellectual property (IP) if the controller is the part of a chipset Huawei KIRIN990

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any

Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the camera can take a picture 4160x3120 pixel
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 13.0 MP camera
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/1.80
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  Phase-Detection Autofocus (PD AF)Phase-detection (PD) is a passive autofocus system which measures the phase difference between a two images to reach correct focus.
Recordable Image FormatsSupported file formats while capturing photos by primary camera  JPG
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 3840x2160 pixel
30 fpsRecording frame rate when recording video at maximum resolution
Recordable Video FormatsSupported file formats while capturing videos  MPEG4
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  No
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  HDR photoHigh dynamic range image recording , Burst mode , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch , Intelligent scene detection

Auxilliary Camera: 
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No

Auxilliary Camera No. 2: 
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No

Auxilliary Camera No. 3: 
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No

Auxilliary Camera No. 4: 
Aux.4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No
Aux. 4 Camera FocusFocusing method of the fourth auxilliary camera  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies

Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Secondary Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can take a picture 3264x2448 pixel
Secondary Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 8.0 MP 2nd camera
Secondary Recordable Image FormatsSupported file formats while capturing photos by secondary camera  JPG
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1920x1080 pixel
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution
Secondary Recordable Video FormatsSupported file formats while capturing videos by the secondary camera  MPEG4
Secondary Camera Extra FunctionsPopular extra features of the secondary camera: Face detection, HDR photo, Selfie Panorama, Smile detection, Face Retouch / Face Beautification  HDR photoHigh dynamic range image recording , Burst mode , Face detection , Face tagging , Smile detection , Face retouch

Secondary Auxilliary Camera: 
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  CMOSComplementary MOS circuit
Number of Pixels of Sec. Aux. Camera A measurement of the maximum pixel number at which the sec. aux. camera can take a picture 1.92 MP 2nd aux. camera
Sec. Aux. Cam. Aperture (W)Wide-angle aperture of sec. auxiliary camera in dual lens secondary camera setup f/2.00

Secondary Auxilliary Camera No. 2: 
Sec. Aux. 2 Cam. Image SensorImage sensor technology of sec. auxiliary 2 camera in at least triple lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 

Built-in accelerometerAn internal component that senses acceleration components of the device.  Used for automatic screen rotation and for games and applications that rely on acceleration measurement  on X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D (3-axis) accelerometer
Built-in gyroscopeAn internal component that senses the orientation of the device.  Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D (3-axis) gyro
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Hall sensor , Light intensity sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen

Ingress ProtectionIngress Protection: 

Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 

BatteryBattery technology  Lithium-ion polymer (LiPo)
built-inPossible options: removable, built-in
Nominal Battery CapacityThe nominal mAh capacity of the battery 7250 mAh battery
Number of battery cellsIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss. 1
Wireless ChargingWireless charging (like Qi, PMA) is a kind of near-field electromagnatic power transmission methods. Inductive coupling is created between a mobile device (secondary coil) and a special charger (primary coil), usually docking station or charging pad.  Qi wireless chargingQi wireless charging standard was announced by Wireless Power Consortium in August 2009. , Qi reverse wireless chargingQi reverse wireless charging capable device is able to charge a Qi wireless charging capable device
Max. Wireless Charging Power:  15.0 W

Geographical AttributesGeographical Attributes: 

Market CountriesCountries where the device was officially sold. Overlap is possible.  China
Market RegionsRegions where the device was officially sold.  Overlap is possible.  Asia

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2019-11-30 23:12
 
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