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Asus NovaGo TP370QL 64GB Detailed Tech Specs

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General AttributesGeneral Attributes: 

BrandBrand name of the device. This may match with the manufacturer Asus
ModelOne or more (separated by /) specific model name identifies this device NovaGo TP370QL 64GB
ReleasedOfficial release date 2018 Mar
AnnouncedDate of the official annoncement 2017 Dec
Hardware DesignerThe company which designed this device ASUSTeK Computer
ManufacturerThe company which produces this device ASUSTeK Computer
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc.  Haptic touch feedbackHaptic (inlcuding kinesthetic) touch device applies forces and vibrations to give feedback to the user when tapping the touchscreen
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  Notebook/laptopNotebook (also known as laptop) is a clamshell portable computer based on PC-like architecture which has large-scaled screen and physical keyboard.
Additional FeaturesLow priority special features which are not included in other fields. Universal Flash Storage 2.0, ASUS Pen support, Precision touchpad (PTP) support with up to four-finger smart gestures
Market CountriesCountries where the device was officially sold. Overlap is possible.  USA
Market RegionsRegions where the device was officially sold.  Overlap is possible.  North America (NA)
VendorMobile operators or distributors which sold the device in their own network Verizon WirelessVerizon Wireless

Physical AttributesPhysical Attributes: 

WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 316 mm
12.44 inches
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 221.6 mm
8.72 inches
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 14.9 mm
0.59 inches
Bounding VolumeThe volume of the smallest cuboid which can bound the device in cubecentimetres 1043.4 ccm
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 1390 g
49.03 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 

Platform:   Windows (desktop-class)Windows for desktops, workstations, servers, notebooks and PC-like netbooks
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Microsoft Windows 10 ProMicrosoft Windows 10 Pro

Application processor, ChipsetApplication processor, Chipset: 

CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 2450 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Qualcomm Snapdragon 835 MSM8998, 2017, 64 bit, octa-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache, 2048 Kbyte L2, 10 nm, Qualcomm Adreno 540 GPUQualcomm Snapdragon 835 MSM8998, 2017, 64 bit, octa-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache, 2048 Kbyte L2, 10 nm, Qualcomm Adreno 540 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  mobile (LP) DDR4 SDRAM
1866 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM) and clock rate (e.g. 200 MHz) determines peak transfer rate (25.6 Mbit/s)
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes) 4096 MiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM
Non-volatile Memory CapacityCapacity of the primary non-volatile memory in mebibytes (binary megabytes)  61035 MiB non-volatile

DisplayDisplayAll parameters that related to display

Display ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 1920x1080
2073600 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 337.82 mm
13.3 inch
Display WidthThe distance between the vertical edges of the display (horizontal display size). In case of display with rounded edges this refers to the smallest bounding rectangle. 294.44 mm
11.59 inch
Display HeightThe distance between the horizontal edges of the display (vertical Display Size). In case of display with rounded edges this refers to the smallest bounding rectangle. 165.62 mm
6.52 inches
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 21.56 mm
Display AreaCalculated display area is the product of horizontal and vertical display sizes. In case of display with rounded edges this refers to the smallest bounding rectangle. 48764.4 square millimeter
Display Area UtilizationDisplay area per front panel area ratio 70%
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio 0.15335 mm/px
Pixel DensityIndicates the number of pixels per inch 166 PPI
Display TypePossible options: Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT, etc.  Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996.
Display Color DepthColor depth defines how many colors or greyscales can be displayed 24 bit/pixel
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.  Light-emitting Diodes
Display Light Reflection ModeThe ratio between reflected and transmitted light depends on reflection mode thus display technology. Possible options: transflective, reflective, transmissive, etc.  Yes
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Possible schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel, etc.  RGB Matrix (3 subpixels)Each pixel has 3 subpixel (Red, Greed, Blue) with the same size. The subpixel order is often R-G-B but B-G-R is also used.
Scratch Resistant ScreenPossible types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass, etc.  No

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Qualcomm Adreno 540
GPU Clock 710 MHz

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  HDMI 2.0 (UHD)HDMI 2.0 specification was published on September 4, 2013 with increased clock speed up to 600 MHz and resolution up to 4096x2160 at 60fps.
HDMI Type A Physical interface of the A/V out port. For example: HDMI D, USB-C, micro-USB or DB25
A/V Out Max. Resolution:   1920x1080 (1080p) FHD

Audio SubsystemAudio Subsystem: 

Audio Channel(s)Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc.  stereo

Sound Recording: 
Microphone(s):   mono
Microphone Input:   3.5mm

Sound Playing: 
Loudpeaker(s):   stereo
Audio Output:   3.5mm

Cellular PhoneCellular Phone: 

Supported Cellular NetworksList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  LTE 1900 MHz (Band 2, PCS)LTE1900 phones support LTE 1900 MHz (PCS , also referred as LTE Band 2) band (downlink: 1930 - 1990 MHz, uplink: 1850 - 1910 MHz), LTE 1700/2100 MHz (Band 4, AWS)LTE1700/2100 phones support LTE 1700 / 2100 MHz (AWS also referred as LTE Band 4) band (downlink: 2110 - 2155 MHz, uplink: 1710 - 1755 MHz), LTE 850 MHz (Band 5)LTE850 phones support LTE 850 MHz (LTE Band 5) band (downlink: 869 - 894 MHz, uplink: 824 - 849 MHz), LTE 700 MHz (Band 13)LTE700 phones support LTE 700 MHz (LTE Band 13) band (downlink: 746 - 756 MHz, uplink: 777 - 787 MHz)
Supported Cellular Data LinksList of supported cellular data links and rates.  LTE (Cat. unspecified)LTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS)., LTE 100 Mbps / 50 Mbps (Cat. 3)LTE 100.8 Mbps / 50.4 Mbps (Cat. 3), LTE 150 Mbps / 50 Mbps (Cat. 4)LTE 151.2 Mbps / 50.4 Mbps (Cat. 4), LTE 1 Gbps (LTE Cat. 16)LTE Category 16: 1000 Mbps downlink, 5 CA
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.  e-SIM (embedded), Nano-SIM (4FF)
Cellular AntennaInternal, fixed, pull-out, etc.  Internal antenna
Cellular ControllerManufacturer part number of the cellular modem and controller IC or commercial name of the intellectual property (IP) if the function is the part of a chipset Qualcomm MSM8998
US standard (max. 1.6 W/kg @ 1g)In case of US (FCC) standard SAR limit is 1.6 W/kg averaged over the 1 g of tissue. measurement methodSAR measurement method (US, EU, etc.) defines the head measurement  procedure, scaling and reference tissue mass (1g, 10g, etc.)

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 

Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch sensing
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect  10-point
Touch Surface TypeDetermines how the touchpad, trackpad or other touch surface module senses the touch of the surface  Yes
Touch Surface Simultaneous Touch PointsDetermines how many touches the touch-sensitive surface is able to simultaneously detect  Yes
KeyboardConventional input peripheral which allows the user to enter characters by pressing a dedicated key  Built-in QWERTY
Keyboard Backlight:   Yes
Number of keys:  80


Communication InterfacesCommunication Interfaces: 

Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash, microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB  , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB., microSD Extended CapacityA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBUSB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 3.1Released in July, 2013, USB 3.1 specification introduced USB SuperSpeed+ enabling devices to communicate at 10 Gbit/s data rate. USB 3.1 standard is backward compatible with USB 2.0 and 3.0.
USB Speed Rate:   Yes
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc., USB On-The-Go 1.3, USB power supplyDevice which meets USB Battery Charging Specification Revision 1.1 is able to supply current from 500 mA to 1.5 A for the client device., USB On-The-Go 2.0
USB Connector:   USB Series A
USB2:   USB 3.1Released in July, 2013, USB 3.1 specification introduced USB SuperSpeed+ enabling devices to communicate at 10 Gbit/s data rate. USB 3.1 standard is backward compatible with USB 2.0 and 3.0.
USB2 Speed Rate:   Yes
USB2 Services:   USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc., USB On-The-Go 1.3, USB power supplyDevice which meets USB Battery Charging Specification Revision 1.1 is able to supply current from 500 mA to 1.5 A for the client device., USB On-The-Go 2.0
USB2 connector:   USB Series A
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Yes
Internal antenna
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (like 802.11n).  IEEE 802.11a, IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11ac
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  MiracastMiracast screensharing standard uses Wi-Fi Direct connection, Wi-Fi Direct
Internal antenna

Multimedia BroadcastMultimedia Broadcast: 

FM Radio Receiver:   No

Satellite NavigationSatellite Navigation: 

Supported GPS protocol(s)Possible protocols: NMEA 0183, SIRF, etc.  GPS (NMEA 0183)NMEA 0183
GPS Antenna:   Internal antenna
Complementary GPS ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Geotagging

Built-in Digital CameraBuilt-in Digital CameraPrimary camera usually has better imaging capabilities than secondary camera if any

Camera PlacementRefers to the placement of the primary camera on the device  Front
Camera Image SensorRefers to the semiconductor technology of image sensor  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
ResolutionA measurement of the maximum size at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 1280x720 pixel
Number of pixels 0.9 MP cam
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/2.00
Optical ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1 x
FocusNo / Not supported means there is no adjustable optical system or no camera built-in at all  Yes
Recordable Image FormatsSupported file formats while capturing photos  JPG
30 fps
Recordable Video FormatsSupported file formats while capturing videos  MJPG, MPEG4
Built-in FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight  No

Built-in Secondary Digital CameraBuilt-in Secondary Digital CameraWidely used for video telephony or taking selfies

Secondary Camera Sensor:   No
Secondary Optical Zoom 1 x

Power SupplyPower Supply: 

BatteryBattery technology  Lithium-ion polymer
built-inPossible options: removable, built-in
Estimated Battery Life 22 hours

Ingress Protection Ingress Protection : 

Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Built-in SensorsBuilt-in Sensors: 

Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Fingerprint sensorDevice is able to identify the user by using a built-in dedicated biometric fingerprint recogniser sensor

Datasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2017-12-07 22:40
 
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