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Asus NovaGo TP370QL 64GB

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General AttributesGeneral Attributes: 

BrandBrand name of the device. This may match with the manufacturer Asus
ModelOne or more (separated by /) specific model name identifies this device NovaGo TP370QL 64GB
ReleasedOfficial release date 2018 Mar
AnnouncedDate of the official annoncement 2017 Dec
Hardware DesignerThe company which designed this device ASUSTeK Computer
ManufacturerThe company which produces this device ASUSTeK Computer
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  NotebookNotebook (also known as laptop) is a clamshell portable computer based on PC-like architecture which has large-scaled screen and physical keyboard.
Market CountriesCountries where the device was officially sold. Overlap is possible.  USA
Market RegionsRegions where the device was officially sold.  Overlap is possible.  North America
VendorMobile operators or distributors which sold the device in their own network Verizon WirelessVerizon Wireless

Physical AttributesPhysical Attributes: 

WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 316 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 221.6 mm
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 14.9 mm
DimensionsAll dimensions are maximal values (measured between the furthest points of the device) in closed state 12.44x8.72x0.59 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 1390 g
49.03 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 

Platform:   Windows (desktop-class)Windows for desktops, workstations, servers, notebooks and PC-like netbooks
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Microsoft Windows 10 ProMicrosoft Windows 10 Pro

Application processor, ChipsetApplication processor, Chipset: 

CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 2450 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Qualcomm Snapdragon 835 MSM8998, 2017, 64 bit, octa-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache, 2048 Kbyte L2, 10 nm, Qualcomm Adreno 540 GPUQualcomm Snapdragon 835 MSM8998, 2017, 64 bit, octa-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache, 2048 Kbyte L2, 10 nm, Qualcomm Adreno 540 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  LPDDR4 SDRAM
1866 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM) and clock rate (e.g. 200 MHz) determines peak transfer rate (25.6 Mbit/s)
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 4.00 GiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 64.0 GB ROM

DisplayDisplayAll parameters that related to display

Display ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 1920x1080
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 337.82 mm
13.3 inch
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 21.56 mm
Display Area UtilizationDisplay area per front panel area ratio 70%
Pixel DensityIndicates the number of pixels per inch 166 PPI
Display TypePossible options: Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT, etc.  Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996.
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Scratch Resistant ScreenPossible types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass, etc.  No

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Qualcomm Adreno 540
GPU Clock 710 MHz

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  HDMI 2.0HDMI 2.0 specification was published on September 4, 2013 with increased clock speed up to 600 MHz and resolution up to 4096x2160 at 60fps.
HDMI APhysical interface of the A/V out port. For example: HDMI D, USB-C, micro-USB or DB25

Audio SubsystemAudio Subsystem: 

Microphone(s):   mono
Loudpeaker(s):   stereo
Audio Output:   3.5mm

Cellular PhoneCellular Phone: 

Supported Cellular NetworksList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  LTE1900 (B2)LTE1900 phones support LTE 1900 MHz (PCS , also referred as LTE Band 2) band (downlink: 1930 - 1990 MHz, uplink: 1850 - 1910 MHz), LTE1700/2100 (B4)LTE1700/2100 phones support LTE 1700 / 2100 MHz (AWS also referred as LTE Band 4) band (downlink: 2110 - 2155 MHz, uplink: 1710 - 1755 MHz), LTE850 (B5)LTE850 phones support LTE 850 MHz (LTE Band 5) band (downlink: 869 - 894 MHz, uplink: 824 - 849 MHz), LTE700 (B13)LTE700 phones support LTE 700 MHz (LTE Band 13) band (downlink: 746 - 756 MHz, uplink: 777 - 787 MHz)
Supported Cellular Data LinksList of supported cellular data links and rates.  LTELTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS)., LTE 100/50LTE 100.8 Mbps / 50.4 Mbps (Cat. 3), LTE 150/50LTE 151.2 Mbps / 50.4 Mbps (Cat. 4), LTE 1000LTE Category 16: 1000 Mbps downlink, 5 CA
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.  e-SIM, Nano-SIM (4FF)

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 

Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch
Touch Surface TypeDetermines how the touchpad, trackpad or other touch surface module senses the touch of the surface  Yes
KeyboardConventional input peripheral which allows the user to enter characters by pressing a dedicated key  Built-in QWERTY
Number of keys:  80

Communication InterfacesCommunication Interfaces: 

Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash, microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB  , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB., microSDXCA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBUSB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 3.1Released in July, 2013, USB 3.1 specification introduced USB SuperSpeed+ enabling devices to communicate at 10 Gbit/s data rate. USB 3.1 standard is backward compatible with USB 2.0 and 3.0.
USB Speed Rate:   Yes
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc., USB OTG 1.3, USB power supplyDevice which meets USB Battery Charging Specification Revision 1.1 is able to supply current from 500 mA to 1.5 A for the client device., USB OTG 2.0
USB Connector:   USB A
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Yes
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (like 802.11n).  802.11a, 802.11b, 802.11g, 802.11n, 802.11ac
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  MiracastMiracast screensharing standard uses Wi-Fi Direct connection, Wi-Fi Direct

Multimedia BroadcastMultimedia Broadcast: 

FM Radio Receiver:   No


Satellite NavigationSatellite Navigation: 

Complementary GPS ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Geotagging

Built-in Digital CameraBuilt-in Digital CameraPrimary camera usually has better imaging capabilities than secondary camera if any

Camera PlacementRefers to the placement of the primary camera on the device  Front
Camera Image SensorRefers to the semiconductor technology of image sensor  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Number of pixels 0.9 MP cam
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/2.00
Optical ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1 x
FocusNo / Not supported means there is no adjustable optical system or no camera built-in at all  Yes
30 fps
Built-in FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight  No

Built-in Secondary Digital CameraBuilt-in Secondary Digital CameraWidely used for video telephony or taking selfies

Secondary Camera Sensor:   No
Secondary Optical Zoom 1 x

Power SupplyPower Supply: 

BatteryBattery technology  Lithium-ion polymer
built-inPossible options: removable, built-in
Estimated Battery Life 22 hours

Ingress Protection Ingress Protection : 

Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Built-in SensorsBuilt-in Sensors: 

Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Fingerprint sensorDevice is able to identify the user by using a built-in dedicated biometric fingerprint recogniser sensor

Datasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2017-12-07 22:40
 
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