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Samsung Chromebook Pro 513C24I Detailed Tech Specs

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General AttributesGeneral Attributes: 

BrandBrand name of the device. This may match with the manufacturer Samsung
ModelOne or more (separated by /) specific model name identifies this device Chromebook Pro 513C24I
ReleasedOfficial release date 2016 Oct
Hardware DesignerThe company which designed this device Samsung Electronics
ManufacturerThe company which produces this device Samsung Electronics
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc.  Active stylusStylus in default package, Rotatable screen
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  Notebook/laptopNotebook (also known as laptop) is a clamshell portable computer based on PC-like architecture which has large-scaled screen and physical keyboard.
Additional FeaturesLow priority special features which are not included in other fields. TPM security chip, 360-degree rotating screen, chiclet-style keyboard

Physical AttributesPhysical Attributes: 

WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 279.4 mm
11 inches
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 220.9 mm
8.7 inches
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 13.9 mm
0.55 inches
Bounding VolumeThe volume of the smallest cuboid which can bound the device in cubecentimetres 857.9 ccm
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 1080 g
38.1 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 

Platform:   Linux
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Chrome OS 1.0Google Chrome OS 1.0

Application processor, ChipsetApplication processor, Chipset: 

CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 1500 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Rockchip RK3399 (OP1), 2016, 64 bit, hexa-core, 28 nm, ARM Mali-T860 GPURockchip RK3399 (OP1), 2016, 64 bit, hexa-core, 28 nm, ARM Mali-T860 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  mobile (LP) DDR3 SDRAM
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes) 4096 MiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM
Non-volatile Memory CapacityCapacity of the primary non-volatile memory in mebibytes (binary megabytes)  30518 MiB non-volatile


DisplayDisplayAll parameters that related to display

Display ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 2400x1600
3840000 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 312.42 mm
12.3 inch
Display WidthThe distance between the vertical edges of the display (horizontal display size). In case of display with rounded edges this refers to the smallest bounding rectangle. 259.95 mm
10.23 inch
Display HeightThe distance between the horizontal edges of the display (vertical Display Size). In case of display with rounded edges this refers to the smallest bounding rectangle. 173.3 mm
6.82 inches
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 19.45 mm
Display AreaCalculated display area is the product of horizontal and vertical display sizes. In case of display with rounded edges this refers to the smallest bounding rectangle. 45049 square millimeter
Display Area UtilizationDisplay area per front panel area ratio 73%
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio 0.10831 mm/px
Pixel DensityIndicates the number of pixels per inch 235 PPI
Display TypePossible options: Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT, etc.  Color ASV TFT LCDColor ASV TFT (Axially Symmetric Vertical). This is an active matrix LCD technology developed by Sharp.
Display Color DepthColor depth defines how many colors or greyscales can be displayed 24 bit/pixel
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.  Yes
Display Light Reflection ModeThe ratio between reflected and transmitted light depends on reflection mode thus display technology. Possible options: transflective, reflective, transmissive, etc.  Yes
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Possible schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel, etc.  RGB Matrix (3 subpixels)Each pixel has 3 subpixel (Red, Greed, Blue) with the same size. The subpixel order is often R-G-B but B-G-R is also used.
Scratch Resistant ScreenPossible types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass, etc.  No

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset ARM Mali-T860MP4

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  DisplayPort (Unspecified)
USB Type-C reversiblePhysical interface of the A/V out port. For example: HDMI D, USB-C, micro-USB or DB25
A/V Out Max. Resolution:   1920x1080 (1080p) FHD

Audio SubsystemAudio Subsystem: 

Audio Channel(s)Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc.  stereo

Sound Recording: 
Microphone(s):   mono

Sound Playing: 
Loudpeaker(s):   Yes
Audio Output:   3.5mm

Cellular PhoneCellular Phone: 

Supported Cellular NetworksList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  No

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 

Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch sensing
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect  10-point
Touch Surface TypeDetermines how the touchpad, trackpad or other touch surface module senses the touch of the surface  Capacitive multi-touch sensing
Touch Surface Simultaneous Touch PointsDetermines how many touches the touch-sensitive surface is able to simultaneously detect  10-point-point
KeyboardConventional input peripheral which allows the user to enter characters by pressing a dedicated key  Built-in QWERTY
Keyboard Backlight:   Yes


Communication InterfacesCommunication Interfaces: 

Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash, microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB  , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB., microSD Extended CapacityA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBUSB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Speed Rate:   USB Hi-Speed (480 Mbps)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc., USB On-The-Go 1.3, USB power supplyDevice which meets USB Battery Charging Specification Revision 1.1 is able to supply current from 500 mA to 1.5 A for the client device.
USB Connector:   USB Type-C reversible
USB2:   USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB2 Speed Rate:   USB Hi-Speed (480 Mbps)
USB2 Services:   USB power supplyDevice which meets USB Battery Charging Specification Revision 1.1 is able to supply current from 500 mA to 1.5 A for the client device.
USB2 connector:   USB Type-C reversible
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Unknown
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (like 802.11n).  IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11ac
Internal antenna

Multimedia BroadcastMultimedia Broadcast: 

FM Radio Receiver:   No

Satellite NavigationSatellite Navigation: 

Supported GPS protocol(s)Possible protocols: NMEA 0183, SIRF, etc.  GPS (NMEA 0183)NMEA 0183
GPS Antenna:   Internal antenna
Complementary GPS ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Geotagging

Built-in Digital CameraBuilt-in Digital CameraPrimary camera usually has better imaging capabilities than secondary camera if any

Camera PlacementRefers to the placement of the primary camera on the device  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor  CMOSComplementary MOS circuit
ResolutionA measurement of the maximum size at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 1280x720 pixel
Number of pixels 0.9 MP cam
Optical ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1 x
FocusNo / Not supported means there is no adjustable optical system or no camera built-in at all  No
Recordable Image FormatsSupported file formats while capturing photos  JPG
Camcorder Resolution 1280x720 pixel
30 fps
Recordable Video FormatsSupported file formats while capturing videos  3GP
Built-in FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight  No

Built-in Secondary Digital CameraBuilt-in Secondary Digital CameraWidely used for video telephony or taking selfies

Secondary Camera Sensor:   No

Power SupplyPower Supply: 

BatteryBattery technology  Lithium-ion polymer
built-inPossible options: removable, built-in
Estimated Battery Life 10 hours

Ingress Protection Ingress Protection : 

Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Built-in SensorsBuilt-in Sensors: 

Built-in accelerometerAn internal component that senses acceleration components of the device.  Used for automatic screen rotation and for games and applications that rely on acceleration measurement  on X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Built-in gyroscopeAn internal component that senses the orientation of the device.  Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes

Datasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2016-10-16 11:05
 
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